产品中心 / Products 更多/more
    • Communication

      Application Product: Digital Fiber-Optic Communication

      发布日期: 2016 - 09 - 25
      Application Industry: communicationApplication Product: Digital Fiber-Optic CommunicationLayers:8Finish : ENIGMaterial: FR4Outer Track W/S: 4/4milInner Track W/S: 3.5/3.5milBoard Thickness: 1.6mmMin. Hole Diameter: 0.45mm
    • Industrial Control

      Application Products: Function Board

      发布日期: 2016 - 09 - 25
      Application Industry: Industrial ControlApplication Products: Function BoardLayer: 16Surface Finish: ENIGMaterial: High TG FR4Outer Track W/S: 4/4milInner Track W/S: 3.5/3.5milBoard Thickness: 2.43mmMin. Hole Diameter: 0.75mm
    • Consumer Electronics

      Application Products: Solid State Disk

      发布日期: 2016 - 09 - 25
      Application Industry: Consumer ElectronicsApplication Products: Solid State DiskLayer: 10Special Processing: Impedance Control, Resin Plugging, Different Copper ThicknessAspect Ratio: 8:1Material: FR4Outer Track W/S: 4/4milInner Track W/S: 5/3.5milBoard Thickness: 2.0mmMin. Hole Diameter: 0.25mm
    • Industrial Control

      Application Products: Hand-held Automobile diagnosis equipment

      发布日期: 2016 - 09 - 25
      Application Industry: Industrial ControlApplication Products: Hand-held Automobile diagnosis equipmentLayer: 10Surface Finish: ENIGMaterial: FR4Outer Ttack W/S: 4.5/2.5milInner Track W/S: 4/3.5milBoard Thickness: 1.0mmMin. Hole Diameter: 0.3mm
    • Consumer electronics

      Application Products: Solid State Disk

      发布日期: 2016 - 09 - 25
      Application Industry: Consumer electronicsApplication Products: Solid State DiskLayer: 8Material: FR4Outer Track W/S: 4/4milInner Track W/S: 3.5/3.5milBoard Thickness: 1.6mmMin. Hole Diameter: 0.25mm
    • Consumer Electronics

      Application Products: MID Tablet Motherboard

      发布日期: 2016 - 09 - 25
      Applocation Industry: Consumer ElectronicsApplication Products: MID Tablet MotherboardLayer: 4Surface Finish: ENIGOuter Track W/S: 4/4milInner Track W/S: 4/4milBoard Thickness: 0.8mmMin. Diameter: 0.25mm
      • Industrial Control

        Application Products: Function Board

        发布日期: 2016 - 09 - 25
        Application Industry: Industrial ControlApplication Products: Function BoardLayer: 16Surface Finish: ENIGMaterial: High TG FR4Outer Track W/S: 4/4milInner Track W/S: 3.5/3.5milBoard Thickness: 2.43mmMin. Hole Diameter: 0.75mm
      • Industrial Control

        Application Products: Hand-held Automobile diagnosis equipment

        发布日期: 2016 - 09 - 25
        Application Industry: Industrial ControlApplication Products: Hand-held Automobile diagnosis equipmentLayer: 10Surface Finish: ENIGMaterial: FR4Outer Ttack W/S: 4.5/2.5milInner Track W/S: 4/3.5milBoard Thickness: 1.0mmMin. Hole Diameter: 0.3mm
      • Industrial Control

        Application Products: Gold Finger Pallet

        发布日期: 2016 - 09 - 25
        Application Industry: Industrial ControlApplication Products: Gold Finger PalletLayer: 10Special Processing: Gold FingerMaterial: Medium TG FR4Outer Track W/S: 4/4milInner Track W/S: 4/4milBoard Thickness: 1.6mmMin. Hole Diameter: 0.2mm
      • Industrial Control

        Application Products: Device Mainboard


        发布日期: 2016 - 09 - 25
        Application Industry: Industrial ControlApplication Products: Device MainboardLayer: 14Special processing: Blind & Buried ViasSurface Finish: ENIGMaterial: FR4Outer Track W/S: 4/5milInner Track W/S: 4/3.5milBoard Thickness: 1.6mmMin. Hole Diameter: 0.2mm
      • Industrial Control

        Application Products: Planer Transformer

        发布日期: 2016 - 09 - 25
        Application Industry: Industrial ControlApplication Products: Planer TransformerLayer: 2Special Processing: Coil Resistance, Heavy CopperSurface Finish: HASLMaterial: TG170, FR4Board Thickness: 1mmMin. Hole Diameter: 0.5mm
      • Industrial Control

        Application Products: Unmanned Aerial Vehicle Motherboard


        发布日期: 2016 - 09 - 25
        Application Industry: Industrial ControlApplication Products: Unmanned Aerial Vehicle MotherboardLayer: 14Special Processing: 0.5CSPSurface Finish: ENIGMaterial: High TG FR4Outer Track W/S: 3.5/3.5milInner Track W/S: 3/3milBoard Thickness: 1.6mmMin. Hole Diameter: 0.15mm
      • Consumer Electronics

        Application Products: Solid State Disk

        发布日期: 2016 - 09 - 25
        Application Industry: Consumer ElectronicsApplication Products: Solid State DiskLayer: 10Special Processing: Impedance Control, Resin Plugging, Different Copper ThicknessAspect Ratio: 8:1Material: FR4Outer Track W/S: 4/4milInner Track W/S: 5/3.5milBoard Thickness: 2.0mmMin. Hole Diameter: 0.25mm
      • Consumer electronics

        Application Products: Solid State Disk

        发布日期: 2016 - 09 - 25
        Application Industry: Consumer electronicsApplication Products: Solid State DiskLayer: 8Material: FR4Outer Track W/S: 4/4milInner Track W/S: 3.5/3.5milBoard Thickness: 1.6mmMin. Hole Diameter: 0.25mm
      • Consumer Electronics

        Application Products: MID Tablet Motherboard

        发布日期: 2016 - 09 - 25
        Applocation Industry: Consumer ElectronicsApplication Products: MID Tablet MotherboardLayer: 4Surface Finish: ENIGOuter Track W/S: 4/4milInner Track W/S: 4/4milBoard Thickness: 0.8mmMin. Diameter: 0.25mm
      • Consumer Electronics

        Application Products: DDR Pinboard


        发布日期: 2016 - 09 - 25
        Application Industry: Consumer ElectronicsApplication Products: DDR PinboardLayer:8Special Surface Finish:ENIGMaterial: FR4Aspect Ratio: 8:1Surface Finish: ENIGOuter Track W/S: 4/4milInner Track W/S: 4/4milBoard Thickness: 2.4mmMin. Hole Diameter : 0.3mm
      • Consumer Eletronics

        Application Products: Mobile Motherboard



        发布日期: 2016 - 09 - 25
        Application Industry: Consumer EletronicsApplication Products: Mobile MotherboardLayer: 8Special processing: HDISurface Finish: ENIGMaterial: HF FR4Outer Track W/S: 3/3milInner Track W/S: 3/3milBoard Thickness: 0.8mmMin. Hole Diameter: 0.1mm
      • Consumer Electronics

        Application Products: USB3.0 Pinboard


        发布日期: 2016 - 09 - 25
        Application Industry: Consumer ElectronicsApplication Products: USB3.0 PinboardLayer: 2Surface Finish: ENIGMaterial: FR4Outer Track W/S: 6/6milBoard Thickness: 1.6mmMin. Hole Diameter: 0.4mm
      • Industrial Control

        Application Products: Interface Board

        发布日期: 2016 - 09 - 25
        Application Industry: Industrial ControlApplication Products: Interface BoardLayer: 4Surface Finish: ENIGMaterial: FR4Outer Track W/S: 5/5milInner Track W/S: 5/5milBoard Thickness: 1.6mmMin. Hole Diameter: 0.3mm
      • Communication

        Application Product: Digital Fiber-Optic Communication

        发布日期: 2016 - 09 - 25
        Application Industry: communicationApplication Product: Digital Fiber-Optic CommunicationLayers:8Finish : ENIGMaterial: FR4Outer Track W/S: 4/4milInner Track W/S: 3.5/3.5milBoard Thickness: 1.6mmMin. Hole Diameter: 0.45mm
      • Communication

        Application Products: Power Amplifier

        发布日期: 2016 - 09 - 25
        Application Industry: CommunicationApplication Products: Power AmplifierLayer: 6Surface Finish: ENIGMaterial: Rogers4350+FR4Outer Track W/S: 7/7milInner Track W/S: 5/5milBoard Thickness: 2.3mmMin. Hole Diameter: 0.6mm
      • Communication

        Application Products:Optic-Fiber Interface Board


        发布日期: 2016 - 09 - 25
        Application Industry: CommunicationApplication Products:Optic-Fiber Interface BoardLayer: 6Material: High TG FR4Special Processing: Leadless Gold FingerOuter Trqack W/S: 5/5milInner Track W/S: 5/5milBoard Thickness: 1.0mmMin. Hole Diameter: 0.2mm
    • Communication

      Application Product: Digital Fiber-Optic Communication

      发布日期: 2016 - 09 - 25
      Application Industry: communicationApplication Product: Digital Fiber-Optic CommunicationLayers:8Finish : ENIGMaterial: FR4Outer Track W/S: 4/4milInner Track W/S: 3.5/3.5milBoard Thickness: 1.6mmMin. Hole Diameter: 0.45mm
    • Industrial Control

      Application Products: Function Board

      发布日期: 2016 - 09 - 25
      Application Industry: Industrial ControlApplication Products: Function BoardLayer: 16Surface Finish: ENIGMaterial: High TG FR4Outer Track W/S: 4/4milInner Track W/S: 3.5/3.5milBoard Thickness: 2.43mmMin. Hole Diameter: 0.75mm
    • Consumer Electronics

      Application Products: Solid State Disk

      发布日期: 2016 - 09 - 25
      Application Industry: Consumer ElectronicsApplication Products: Solid State DiskLayer: 10Special Processing: Impedance Control, Resin Plugging, Different Copper ThicknessAspect Ratio: 8:1Material: FR4Outer Track W/S: 4/4milInner Track W/S: 5/3.5milBoard Thickness: 2.0mmMin. Hole Diameter: 0.25mm
    • Application Industry: Industrial Control

      Application Products: Hand-held Automobile diagnosis equipment

      发布日期: 2016 - 09 - 25
      Application Industry: Industrial ControlApplication Products: Hand-held Automobile diagnosis equipmentLayer: 10Surface Finish: ENIGMaterial: FR4Outer Ttack W/S: 4.5/2.5milInner Track W/S: 4/3.5milBoard Thickness: 1.0mmMin. Hole Diameter: 0.3mm
    • Consumer electronics

      Application Products: Solid State Disk

      发布日期: 2016 - 09 - 25
      Application Industry: Consumer electronicsApplication Products: Solid State DiskLayer: 8Material: FR4Outer Track W/S: 4/4milInner Track W/S: 3.5/3.5milBoard Thickness: 1.6mmMin. Hole Diameter: 0.25mm
    • Consumer electronics

      Application Products: MID Tablet Motherboard

      发布日期: 2016 - 09 - 25
      Applocation Industry: Consumer ElectronicsApplication Products: MID Tablet MotherboardLayer: 4Surface Finish: ENIGOuter Track W/S: 4/4milInner Track W/S: 4/4milBoard Thickness: 0.8mmMin. Diameter: 0.25mm
      • Communication

        Application Products: Power Amplifier

        发布日期: 2016 - 09 - 25
        Application Industry: CommunicationApplication Products: Power AmplifierLayer: 6Surface Finish: ENIGMaterial: Rogers4350+FR4Outer Track W/S: 7/7milInner Track W/S: 5/5milBoard Thickness: 2.3mmMin. Hole Diameter: 0.6mm
      • Consumer Electronics

        Application Products: USB3.0 Pinboard


        发布日期: 2016 - 09 - 25
        Application Industry: Consumer ElectronicsApplication Products: USB3.0 PinboardLayer: 2Surface Finish: ENIGMaterial: FR4Outer Track W/S: 6/6milBoard Thickness: 1.6mmMin. Hole Diameter: 0.4mm
      • Industrial Control

        Application Products: Interface Board

        发布日期: 2016 - 09 - 25
        Application Industry: Industrial ControlApplication Products: Interface BoardLayer: 4Surface Finish: ENIGOuter Track W/S: 5/5milInner Track W/S: 5/5milBoard Thickness: 1.6mmMin. Hole Diameter: 0.3mm
      • Industrial Control

        Application Products: Communications network


        发布日期: 2018 - 11 - 07
        Application Industry: Industrial ControlApplication Products: Communications networkLayer: 6Surface Finish: ENIGOuter Track W/S: 10/5milInner Track W/S: 7/5milBoard Thickness: 1.6mmMin. Hole Diameter: 0.25mm
      • Industrial Control

        Application Products: Device Mainboard


        发布日期: 2016 - 09 - 25
        Application Industry: Industrial ControlApplication Products: Device MainboardLayer: 14Special processing: Blind & Buried ViasSurface Finish: ENIGMaterial: FR4Outer Track W/S: 4/5milInner Track W/S: 4/3.5milBoard Thickness: 1.6mmMin. Hole Diameter: 0.2mm
      • Consumer Electronics

        Application Products: Pan-Tilt Control Board


        发布日期: 2016 - 09 - 25
        Application Industry: Consumer ElectronicsApplication Products: Pan-Tilt Control BoardLayer: 4Special Processing: Rigid-Flex BoardSurface Finish: ENIGMaterial: SF302+FR4Outer Track W/S: 5/5milInner Track W/S: 6/6milBoard Thickness: 1.0mmMin. Hole Diameter: 0.3mm
      • Consumer Eletcronics

        Application Products: wearable devices

        发布日期: 2016 - 09 - 25
        Application Industry: Consumer EletcronicsApplication Products: wearable devicesLayer: 4Special Processing: Rigid-FlexMaterial: FR4+FPCOuter Track W/S: 4/3.5milInner Track W/S: 5/4milBoard Thickness: 0.5mmMin. Hole Diameter: 0.2mm
      • Consumer Electronics

        Application Products: Digital Image Acquisition Processor

        发布日期: 2016 - 09 - 25
        Application Industry: Consumer ElectronicsApplication Products: Digital Image Acquisition ProcessorLayer: 4Special Processing: Rigid-Flex BoardSurface Finish: ENIGMaterial: FR4 + FPCOuter Track W/S: 3.5/3.5milInner Track W/S: 4/4milBoard Thickness: 0.5mmMIn. Hole Diameter: 0.2mm
      • Industrial Control



        发布日期: 2016 - 09 - 25
        Application Industry: Industrial ControlLayer:10Special Processing: Gold FingerSurface Finish: ENIGMaterial: Medium TG FR4Outer Track W/S : 4/4milBoard Thickness : 1.6mmMin. Hole Diameter: 0.2mm
      • Communication

        Application Product: Fiber-Optic Interface Board


        发布日期: 2016 - 09 - 25
        Application Industry: CommunicationApplication Product: Fiber-Optic Interface BoardLayer: 6Special Processing: Gold FingerSurface Finish: Immersion GoldMaterial:High TG FR4Outer Layer Track W/S: 5/5milInner Layer Track W/S: 5/5milBoard Thickness: 1.0mmMin. Hole Diameter: 0.2mm
      • Consumer Electronics

        Application Products: Solid State Disk

        发布日期: 2016 - 09 - 25
        Application Industry: Consumer ElectronicsApplication Products: Solid State DiskLayer: 10Special Processing: Impedance Control, Resin Plugging, Different Copper ThicknessAspect Ratio: 8:1Material: FR4Outer Track W/S: 4/4milInner Track W/S: 5/3.5milBoard Thickness: 2.0mmMin. Hole Diameter: 0.25mm
      • Industrial Control

        Application Products: Intelligent Tracffic Control Board


        发布日期: 2016 - 09 - 25
        Application Industry: Industrial ControlApplication Products: Intelligent Tracffic Control BoardLayer: 12Special Processing: 5/5mil Impedance ControlSurface Finish: ENIGMaterial: FR4Outer Track W/S: 5/4milInner Track W/S: 4/5milBoard Thickness: 3.0mmMin. Hole Diameter: 0.3mm
      • Consumer Electronics

        Application Products: Solid State Disk

        发布日期: 2016 - 09 - 25
        Application Industry: Consumer ElectronicsApplication Products: Solid State DiskLayer: 8Special Processing: Impedance ControlSurface Finish: ENIGMaterial: High TG FR4Outer Track W/S: 3.5/4milInner Track W/S: 4/3.5milBoard Thickness: 1.0mmMin. Hole Diameter: 0.2mm
      • Consumer Eletronics

        Application Products: Automobile Recorder Camera


        发布日期: 2016 - 09 - 25
        Application Industry: Consumer EletronicsApplication Products: Automobile Recorder CameraLayer: 4Special Processing: Impedance Control, Edge PlatingSurface Finish: HASLMaterial: FR4Outer Track W/S: 5/3milInner Track W/S: 9/9milBoard Thickness: 1.2mmMin. Hole Diameter: 0.3mm
      • Consumer Electronics

        Application Products: Bluetooth Headset

        发布日期: 2016 - 09 - 25
        Application Industry: Consumer ElectronicsApplication Products: Bluetooth HeadsetLayer: 4Special Processing: Impedance Control, Edge PlatingMaterial: FR4Outer Track W/S: 6/4milInner Track W/S: 6/5milBoard Thickness: 0.8mmMin. Hole Diameter: 0.2mm
      • Application Industry: Consumer Eletronics

        Application Products: SCS Board

        发布日期: 2016 - 09 - 25
        Application Industry: Consumer EletronicsApplication Products: SCS BoardLayer:4Special Processing: Impedance ControlSurface Finish: ENIGMaterial: FR4Outer Track W/S: 3.5/3.5milInner Track W/S: 3.5/3milBoard Thickness: 0.8mmMin. Hole Diameter: 0.2mm
      • Communication

        Application Product: Digital Fiber-Optic Communication

        发布日期: 2016 - 09 - 25
        Application Industry: communicationApplication Product: Digital Fiber-Optic CommunicationLayers:8Finish : ENIGMaterial: FR4Outer Track W/S: 4/4milInner Track W/S: 3.5/3.5milBoard Thickness: 1.6mmMin. Hole Diameter: 0.45mm
      • Industrial Control

        Application Products: Function Board

        发布日期: 2016 - 09 - 25
        Application Industry: Industrial ControlApplication Products: Function BoardLayer: 16Surface Finish: ENIGMaterial: High TG FR4Outer Track W/S: 4/4milInner Track W/S: 3.5/3.5milBoard Thickness: 2.43mmMin. Hole Diameter: 0.75mm
      • Application Industry: Industrial Control

        Application Products: Hand-held Automobile diagnosis equipment

        发布日期: 2016 - 09 - 25
        Application Industry: Industrial ControlApplication Products: Hand-held Automobile diagnosis equipmentLayer: 10Surface Finish: ENIGMaterial: FR4Outer Ttack W/S: 4.5/2.5milInner Track W/S: 4/3.5milBoard Thickness: 1.0mmMin. Hole Diameter: 0.3mm
      • Consumer electronics

        Application Products: Solid State Disk

        发布日期: 2016 - 09 - 25
        Application Industry: Consumer electronicsApplication Products: Solid State DiskLayer: 8Material: FR4Outer Track W/S: 4/4milInner Track W/S: 3.5/3.5milBoard Thickness: 1.6mmMin. Hole Diameter: 0.25mm
      • Consumer electronics

        Application Products: MID Tablet Motherboard

        发布日期: 2016 - 09 - 25
        Applocation Industry: Consumer ElectronicsApplication Products: MID Tablet MotherboardLayer: 4Surface Finish: ENIGOuter Track W/S: 4/4milInner Track W/S: 4/4milBoard Thickness: 0.8mmMin. Diameter: 0.25mm
      • Consumer Eletronics

        Application Products: Mobile Motherboard



        发布日期: 2016 - 09 - 25
        Application Industry: Consumer EletronicsApplication Products: Mobile MotherboardLayer: 8Special processing: HDISurface Finish: ENIGMaterial: HF FR4Outer Track W/S: 3/3milInner Track W/S: 3/3milBoard Thickness: 0.8mmMin. Hole Diameter: 0.1mm
      • Industrial Control

        Application Products: Planer Transformer

        发布日期: 2016 - 09 - 25
        Application Industry: Industrial ControlApplication Products: Planer TransformerLayer: 2Special Processing: Coil Resistance, Heavy CopperSurface Finish: HASLMaterial: TG170, FR4Board Thickness: 1mmMin. Hole Diameter: 0.5mm
      • Consumer Eletronics

        Application Products: Automobile Recorder Camera

        发布日期: 2016 - 09 - 26
        Application Industry: Consumer EletronicsApplication Products: Automobile Recorder CameraLayer: 4Special Processing: Impedance Control, Edge PlatingSurface Finish: HASLMaterial: FR4Outer Track W/S: 5/3milInner Track W/S: 9/9milBoard Thickness: 1.2mmMin. Hole Diameter: 0.3mm
      • Consumer Electronics

        Application Products: Bluetooth Headset



        发布日期: 2016 - 09 - 26
        Application Industry: Consumer ElectronicsApplication Products: Bluetooth HeadsetLayer: 4Special Processing: Impedance Control, Edge PlatingMaterial: FR4Outer Track W/S: 6/4milInner Track W/S: 6/5milBoard Thickness: 0.8mmMin. Hole Diameter: 0.2mm
      • Consumer Electronics

        Application Products: Navigator



        发布日期: 2016 - 09 - 26
        Application Industry: Consumer ElectronicsApplication Products: NavigatorLayer: 6Special Processing: ENIGMaterial: FR4Outer Track W/S: 4/4milInner Track W/S: 4/3.5milBoard Thickness: 1.2mmMin. Hole Diameter: 0.2mm
    • Communication

      Application Products: Digital Fiber-Optic Communication

      发布日期: 2016 - 09 - 25
      Application Industry: communicationApplication Product: Digital Fiber-Optic CommunicationLayers:8Finish : ENIGMaterial: FR4Outer Track W/S: 4/4milInner Track W/S: 3.5/3.5milBoard Thickness: 1.6mmMin. Hole Diameter: 0.45mm
    • Industrial Control

      Application Products: Function Board

      发布日期: 2016 - 09 - 25
      Application Industry: Industrial ControlApplication Products: Function BoardLayer: 16Surface Finish: ENIGMaterial: High TG FR4Outer Track W/S: 4/4milInner Track W/S: 3.5/3.5milBoard Thickness: 2.43mmMin. Hole Diameter: 0.75mm
    • Consumer Electronics

      Application Products: Solid State Disk

      发布日期: 2016 - 09 - 25
      Application Industry: Consumer ElectronicsApplication Products: Solid State DiskLayer: 10Special Processing: Impedance Control, Resin Plugging, Different Copper ThicknessAspect Ratio: 8:1Material: FR4Outer Track W/S: 4/4milInner Track W/S: 5/3.5milBoard Thickness: 2.0mmMin. Hole Diameter: 0.25mm
    • Industrial Control

      Application Products: Hand-held Automobile diagnosis equipment

      发布日期: 2016 - 09 - 25
      Application Industry: Industrial ControlApplication Products: Hand-held Automobile diagnosis equipmentLayer: 10Surface Finish: ENIGMaterial: FR4Outer Ttack W/S: 4.5/2.5milInner Track W/S: 4/3.5milBoard Thickness: 1.0mmMin. Hole Diameter: 0.3mm
    • Consumer electronics

      Application Products: Solid State Disk

      发布日期: 2016 - 09 - 25
      Application Industry: Consumer electronicsApplication Products: Solid State DiskLayer: 8Material: FR4Outer Track W/S: 4/4milInner Track W/S: 3.5/3.5milBoard Thickness: 1.6mmMin. Hole Diameter: 0.25mm
    • Consumer electronics

      Application Products: MID Tablet Motherboard

      发布日期: 2016 - 09 - 25
      Applocation Industry: Consumer electronicsApplication Products: MID Tablet MotherboardLayer: 4Surface Finish: ENIGOuter Track W/S: 4/4milInner Track W/S: 4/4milBoard Thickness: 0.8mmMin. Diameter: 0.25mm
      • Communication

        Application Products: Digital Fiber-Optic Communication

        发布日期: 2016 - 09 - 25
        Application Industry: communicationApplication Product: Digital Fiber-Optic CommunicationLayers:8Finish : ENIGMaterial: FR4Outer Track W/S: 4/4milInner Track W/S: 3.5/3.5milBoard Thickness: 1.6mmMin. Hole Diameter: 0.45mm
      • Consumer Electronics

        Application Products: Solid State Disk

        发布日期: 2016 - 09 - 25
        Application Industry: Consumer ElectronicsApplication Products: Solid State DiskLayer: 10Special Processing: Impedance Control, Resin Plugging, Different Copper ThicknessAspect Ratio: 8:1Material: FR4Outer Track W/S: 4/4milInner Track W/S: 5/3.5milBoard Thickness: 2.0mmMin. Hole Diameter: 0.25mm
      • Industrial Control

        Application Products: Hand-held Automobile diagnosis equipment

        发布日期: 2016 - 09 - 25
        Application Industry: Industrial ControlApplication Products: Hand-held Automobile diagnosis equipmentLayer: 10Surface Finish: ENIGMaterial: FR4Outer Ttack W/S: 4.5/2.5milInner Track W/S: 4/3.5milBoard Thickness: 1.0mmMin. Hole Diameter: 0.3mm
      • Consumer electronics

        Application Products: Solid State Disk

        发布日期: 2016 - 09 - 25
        Application Industry: Consumer electronicsApplication Products: Solid State DiskLayer: 8Material: FR4Outer Track W/S: 4/4milInner Track W/S: 3.5/3.5milBoard Thickness: 1.6mmMin. Hole Diameter: 0.25mm
      • Consumer electronics

        Application Products: MID Tablet Motherboard

        发布日期: 2016 - 09 - 25
        Applocation Industry: Consumer electronicsApplication Products: MID Tablet MotherboardLayer: 4Surface Finish: ENIGOuter Track W/S: 4/4milInner Track W/S: 4/4milBoard Thickness: 0.8mmMin. Diameter: 0.25mm
      • Industrial Control

        Application Products: Gold Finger Pallet

        发布日期: 2016 - 09 - 25
        Application Industry: Industrial ControlApplication Products: Gold Finger Palletlayer: 10Special Processing: Gold FingerMaterial: Medium TG FR4Outer Track W/S: 4/4milInner Track W/S: 4/4milBoard Thickness: 1.6mmMin. Hole Diameter: 0.2mm
      • Consumer Electronics

        Application Products: Pan-Tilt Control Board

        发布日期: 2016 - 09 - 25
        Application Industry: Consumer ElectronicsApplication Products: Pan-Tilt Control BoardLayer: 4Special Processing: Rigid-Flex BoardSurface Finish: ENIGMaterial: SF302+FR4Outer Track W/S: 5/5milInner Track W/S: 6/6milBoard Thickness: 1.0mmMin. Hole Diameter: 0.3mm
      • Consumer Eletcronics

        Application Products: wearable devices

        发布日期: 2016 - 09 - 25
        Application Industry: Consumer EletcronicsApplication Products: wearable devicesLayer: 4Special Processing: Rigid-FlexMaterial: FR4+FPCOuter Track W/S: 4/3.5milInner Track W/S: 5/4milBoard Thickness: 0.5mmMin. Hole Diameter: 0.2mm
      • Consumer Electronics

        Application Products: Digital Image Acquisition Processor



        发布日期: 2016 - 09 - 25
        Application Industry: Consumer ElectronicsApplication Products: Digital Image Acquisition ProcessorLayer: 4Special Processing: Rigid-Flex BoardSurface Finish: ENIGMaterial: FR4 + FPCOuter Track W/S: 3.5/3.5milInner Track W/S: 4/4milBoard Thickness: 0.5mmMIn. Hole Diameter: 0.2mm
      • Communication

        Application Products: Power Amplifier

        发布日期: 2016 - 09 - 25
        Application Industry: CommunicationApplication Products: Power AmplifierLayer: 6Surface Finish: ENIGMaterial: Rogers4350+FR4Outer Track W/S: 7/7milInner Track W/S: 5/5milBoard Thickness: 2.3mmMin. Hole Diameter: 0.6mm
      • Industrial Control

        Application Products: Function Board

        发布日期: 2016 - 09 - 25
        Application Industry: Industrial ControlApplication Products: Function BoardLayer: 16Surface Finish: ENIGMaterial: High TG FR4Outer Track W/S: 4/4milInner Track W/S: 3.5/3.5milBoard Thickness: 2.43mmMin. Hole Diameter: 0.75mm
      • Industrial Control

        Application Products: Planer Transformer

        发布日期: 2016 - 09 - 25
        Application Industry: Industrial ControlApplication Products: Planer TransformerLayer: 2Special Processing: Coil Resistance, Heavy CopperSurface Finish: HASLMaterial: TG170, FR4Board Thickness: 1mmMin. Hole Diameter: 0.5mm
      • Industrial control

        Application Products: unmanned aerial vehicle mainboard


        发布日期: 2016 - 09 - 25
        Application Industry: Industrial controlApplication Products: unmanned aerial vehicle mainboardLayer: 14Special Processing: 0.5CSPMaterial: High TG FR4Outer Track W/S: 3.5/3.5milInner Track W/S: 3/3milBoard Thickness: 1.6mmMin. Hole Diameter: 0.15mm
      • Consumer Electronics

        Application Products: Solid State Disk


        发布日期: 2016 - 09 - 25
        Application Industry: Consumer ElectronicsApplication Products: Solid State DiskLayer: 8Special Processing: Impedance ControlSurface Finish: ENIGMaterial: High TG FR4Outer Track W/S: 3.5/4milInner Track W/S: 4/3.5milBoard Thickness: 1.0mmMin. Hole Diameter: 0.2mm
      • Communication

        Application Products: Optic-Fiber Interface Board


        发布日期: 2016 - 09 - 25
        Application Industry: CommunicationApplication Products: Optic-Fiber Interface BoardLayer: 6Special Processing: Leadless Gold FingerSyrface Finish: ENIGMaterial: High TG FR4Outer Track W/S: 5/5milInner Track W/S: 5/5milBoard Thickness: 1.0mmMin. Hole Diameter: 0.2mm

Why Huihe Circuits?

Your Best Choice

  R & D

Our technical team does DFM review for prototyping products.

Sophisticated equipment is gradually introduced to ensure excellent process capabilities.

More than 10 experts with over 10-year PCB experience, proficient in industry standards, process stability and product quality.

Maintain close cooperation with universities and research institutes, develop advanced PCB manufacturing technologies.

  Manufacturing

High-quality raw materials
Base materials:Rogers, Arlon, Shengyi    Chemicals:  Rohm Haas, Atotech, Cerambus
Solder mask ink: Taiyo    Dry film : Hitachi

Strict quality control systems
Strictly control process stability and improve yield.
All PCBs are inspected to IPC-A600 Class 2 or higher standards.
Implement PDCA process to increasingly improve product quality and performance.

Significantly shorten delivery time
Initiate and promote Lean Production, effectively monitor production schedules, increase on-time delivery rate. 
Ensure on-time delivery rate of urgent orders up to 99% and regular orders up to 95%.

Service System

Our sales team offers rapid and excellent pre-sales, after-sales service.

Supply chain integration and cost reduction guarantee competitive price for our customers.

Quick response to RFQ's, detailed quote lists are available (including material costs, tooling fees, and engineering costs).

Streamline the processing of manufacturing data, to ensure production data can be audited and confirmed by customers at the earliest time.

FAQ's / FAQ More
浏览次数: 243
发布时间: 2016 - 10 - 20
The development of PCB and FPC led birth of rigid flex boards. Rigid flex printed circuit boards are PCBs using a combination of flexible and rigid board technologies. Rigid flex boards are PCBs with combination of FPC and PCB. First, electronic engineers draw circuits and shape according to production requirements. Then the order will be issued to factory with production capability of soft and hard combined PCB board. After CAM engineers process the file, then arrange FPC and PCB production lines to finish PCBs. These two kinds of boards will be seamlessly laminated. Due to high complex production process control and value, all rigid flex PCBs should be 100% detected before shipment.  Rigid flex PCBs are used for special products with flexible and rigid areas and requirements of...
浏览次数: 66
发布时间: 2015 - 04 - 02
Today's high density interconnect (HDI) printed circuit boards (PCBs) increase the functionality of a circuit board while utilizing less area, driven by the miniaturization of components and IC substrate packages. This enables the use of an increasing number of advanced features in today's mobile and high-performance devices. As the pin count of substrate packages increases, and/or the pitch count decreases, HDI structures provide a solution to the very complex routing requirements of these devices. Dow Electronic Materials continues to innovate with enhanced Cu via fill chemistries that are central to the ability to build HDI boards. Today, enhanced via-fill (EVF) must repeatably produce void-free filled laser micro-vias while plating the through-holes with sufficient copper to provi...
浏览次数: 166
发布时间: 2016 - 11 - 12
As we introduced before what is Ball Grid Array. A ball grid array (BGA) is a type of surface-mount packaging (a chip carrier) used for integrated circuits. BGA packages are used to permanently mount devices such as microprocessors. There are mainly three types of BGAs: PBGA (plastic ball grid array), CBGA (ceramic ball grid array), and TBGA (tape ball grid array). A specific form of the BGA can have a certain size, but should use the same physical structure and the same material. The following will focus on the analysis of three specific BGA package, each kind of structure form is different.PBGACurrently the most common production of BGA package form is plastic ball grid array package PBGA. It has the advantages of: - glass fiber and BT resin substrates and 0.4mm thick - chip is dire...
浏览次数: 188
发布时间: 2016 - 11 - 12
What's OSP ?OSP (Organic Solderability Preservative) is the most popular final surface finishing for PWBs.OSP film has excellent humidity resistance to protect copper oxidation. For example, F2 series protect copper surface up to twelve month. Copper surface (Before OSP)Cross section of OSP film (FIB) (After OSP)Why OSP ?OSP has a lot of features.OSP process is lower cost than HASL and the other metal finishes.OSP process is good environmental. (VOC free etc.)OSP film is available for lead free solder application.Good solder joint strength compare with Ni/Au plating. Mechanism of OSP film formation ?  OSP products line up ?We can develop the active ingredient imidazole by our selves and we can supply the suitable OSP for each assembly process.  GlicoatGlicoat-...
About us / About Us
IntroductionXinfeng HUIHE Circuits Co., Ltd.Shenzhen HUIHE Circuits Co., Ltd.    Founded in 2011, HUIHE Circuits specializes in R&D of high-density multilayer boards, PCB prototype and volume production. With its headquarters in Shenzhen, China, there are two wholly-owned companies in Shenzhen (Shenzhen HUIHE Circuits Co., Ltd.) and Jiangxi ( Xinfeng HUIHE Circuits Co., Ltd.). We always adhere to the principle of quality first.    HUIHE Circuits Co., Ltd. has been certified for ISO 9001, and the products have been certified for UL, SGS and ROHS. With a professional technology development team, HUIHE Circuits has mastered advanced technology and possessed reliable production equipment, test equipment and fully functional P&C lab. Our products include 2-28 layers board, HDI board, high TG heavy copper board, rigid-flex board, high frequency board , mixed-dielectric laminate, buried &blind via boar...
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Equipment Display / About us
 Scrubber Machine
Scrubber Machine
 Etching & Stripping Machine
Etching & Stripping Machine
 AOI
AOI
 Developer Machine
Developer Machine
 Laminating Machine
Laminating Machine
 Automatic Plating Line
Automatic Plating Line
 Drilling Machine
Drilling Machine
 Automatic V-Cut Machine
Automatic V-Cut Machine
 Flying Probe Tester
Flying Probe Tester
News /  
Five Characteristics of a Reliable Circuit Supplier
Due diligence when selecting a source for a custom electronic product can be a critical sourcing procedure. Chains are only as good as the weakest link, and the electronic components assembled to create a marketable product need to combine into a robust solution. Fitting a mix of pieces together that have been manufactured by disparate companies into a robust final assembly requires high reliability in each component. But choosing a reliable supplier in the flexible circuit industry can be difficult to mitigate for a number of reasons: Tooling Investment. PCB are custom designed and built for a specific part number. As such, there is a front-end cost and set-up charge needed for the design, panelization and tooling. Sourcing a PCB manufacturer requires an investment, both in tooling and the engineering time to define the product. Switching suppliers requires new set-up charges in addition to time required to get a second supplier qualified and producing. Products requiring hi...
2016 - 09 - 24
IPC Celebrates 5th Annual Manufacturing Day
IPC is proud to celebrate today's 5th annual Manufacturing Day, alongside a group of industry sponsors and co-producers. On this day, manufacturers around the country are joining in a unified effort to highlight current innovations in the electronics industry and inspire the next generation of manufacturing professionals.  "Each year, Manufacturing Day exemplifies the significant contributions our industry makes nationwide," said IPC President and CEO John Mitchell. "IPC and its member companies have witnessed the strides our industry has made this year and look forward to continued growth for years to come."  As part of Manufacturing Day 2016, IPC member company Arc-Tronics Inc. is hosting a site visit for community leaders at their facility in Elk Grove Village, Illinois. Attendees will include: Elk Grove Village Trustees Jim Petri, Sam Lissner and Pat Feicher, along with Dan McManus, district representative for Congresswoman Tammy Duckworth (D...
2016 - 09 - 24
OPPO Tops the Chinese Smartphone Market for the First Time
According to IDC’s latest Asia/Pacific Quarterly Mobile Phone Tracker, the China smartphone market grew 5.8% YoY and 3.6% QoQ in the third quarter of 2016, with OPPO and vivo overtaking Huawei for the first time in the market.   Vendor dynamics OPPO and vivo rose because the Chinese market has evolved beyond operator and online driven channels over to an offline structure that dovetails with OPPO and vivo's strengths. There were three key growth phases of the Chinese smartphone market seen in the past few years.  The first phase (before 2014) was when it was driven mainly by operators. Samsung, Lenovo, and Coolpad led the smartphone market then with the help of huge subsidies offered by operators.  In the second phase (2014-2015), with e-commerce booming in China, Xiaomi was one of the first vendors that rode on that e-commerce wave and disrupted the market by selling its phones online through its flash sales. That kicked off another trend as other ve...
2016 - 09 - 24
From Automotive to IoT, electronica 2016 Has a Supporting Program
From November 8–11, 2016, the international electronics industry will meet in Munich at the world's leading trade fair for electronic components, systems and applications. Besides more than 2,800 international exhibitors, visitors can expect an extensive supporting program with four conferences and five forums. From the Cyber Security Forum and the electronica Automotive Conference to the CEO Roundtable: Experts and exhibitors will present and discuss the latest developments from around the world at electronica. With an eye on current trends, electronica 2016 will focus on it main themes, i.e. Automotive, Embedded Systems, Solid State Lighting, Wearables and Healthcare as well as the related topics of cyber security and the Internet of Things. All of these topics will also be reflected in the supporting program.  CEO Roundtable One of electronica's highlights is on the first day of the fair: the CEO Roundtable. The theme is “Connected Worlds—Safe and Secure,” and leading...
2016 - 09 - 24
China
Numerous major participants in the global semiconductor sector are engaging in deal-making to make themselves larger and more competitive. As a result, different industries within the sector will be controlled by fewer companies in the future.    In China, consolidation will also take place within the three broad sections of the semiconductor sector, namely foundry, IC testing/packaging and fabless design. According to the global market research firm TrendForce, various Chinese semiconductor enterprises will be integrated under the “virtual IDM” model during 2017. At the same time, the trend of integration will also become more noticeable among Chinese providers of semiconductor manufacturing equipment.  In the foundry industry, Chinese participants are lagging behind international competitors. Leading domestic foundry SMIC is currently using the 28nm process as its most advanced technology for mass production. While most international foundries have achie...
2016 - 09 - 24
Increasing Demand for Compact Electronics Driving Growth for 3D IC Market
The global 3D ICs market is considerably consolidated, with Taiwan Semiconductor Manufacturing Co. Ltd (TSMC) and Samsung Electronics Co. Ltd collectively accounting more than 50%, and a host of mid-sized and small companies holding the remaining market share as of 2012, according to a new report by Transparency Market Research (TMR). Product development through strategic collaborations is on the growth charts of top companies in the global 3D ICs market. A case in point is TSMC, which has collaborated with a host of electronic design automation vendors for the manufacture of 3D IC reference flows and 16 nm FinFet. For instance, TSMC collaborated with Cadence Design Systems Inc. to develop a particular 3D IC reference flow, which helps in inventive 3D stacking. Business expansion through R&D of 3D ICs is also what key companies in this market are focused on. Companies are planning to strengthen their R&D efforts for the development of new technologies. Product diversi...
2016 - 09 - 24
Five Characteristics of a Reliable Circuit Supplier
Due diligence when selecting a source for a custom electronic product can be a critical sourcing procedure. Chains are only as good as the weakest link, and the electronic components assembled to create a marketable product need to combine into a robust solution. Fitting a mix of pieces together that have been manufactured by disparate companies into a robust final assembly requires high reliability in each component. But choosing a reliable supplier in the flexible circuit industry can be difficult to mitigate for a number of reasons: Tooling Investment. PCB are custom designed and built for a specific part number. As such, there is a front-end cost and set-up charge needed for the design, panelization and tooling. Sourcing a PCB manufacturer requires an investment, both in tooling and the engineering time to define the product. Switching suppliers requires new set-up charges in addition to time required to get a second supplier qualified and producing. Products requiring hi...
2016 - 09 - 24
IPC Celebrates 5th Annual Manufacturing Day
IPC is proud to celebrate today's 5th annual Manufacturing Day, alongside a group of industry sponsors and co-producers. On this day, manufacturers around the country are joining in a unified effort to highlight current innovations in the electronics industry and inspire the next generation of manufacturing professionals.  "Each year, Manufacturing Day exemplifies the significant contributions our industry makes nationwide," said IPC President and CEO John Mitchell. "IPC and its member companies have witnessed the strides our industry has made this year and look forward to continued growth for years to come."  As part of Manufacturing Day 2016, IPC member company Arc-Tronics Inc. is hosting a site visit for community leaders at their facility in Elk Grove Village, Illinois. Attendees will include: Elk Grove Village Trustees Jim Petri, Sam Lissner and Pat Feicher, along with Dan McManus, district representative for Congresswoman Tammy Duckworth (D...
2016 - 09 - 24
OPPO Tops the Chinese Smartphone Market for the First Time
According to IDC’s latest Asia/Pacific Quarterly Mobile Phone Tracker, the China smartphone market grew 5.8% YoY and 3.6% QoQ in the third quarter of 2016, with OPPO and vivo overtaking Huawei for the first time in the market.   Vendor dynamics OPPO and vivo rose because the Chinese market has evolved beyond operator and online driven channels over to an offline structure that dovetails with OPPO and vivo's strengths. There were three key growth phases of the Chinese smartphone market seen in the past few years.  The first phase (before 2014) was when it was driven mainly by operators. Samsung, Lenovo, and Coolpad led the smartphone market then with the help of huge subsidies offered by operators.  In the second phase (2014-2015), with e-commerce booming in China, Xiaomi was one of the first vendors that rode on that e-commerce wave and disrupted the market by selling its phones online through its flash sales. That kicked off another trend as other ve...
2016 - 09 - 24
From Automotive to IoT, electronica 2016 Has a Supporting Program
From November 8–11, 2016, the international electronics industry will meet in Munich at the world's leading trade fair for electronic components, systems and applications. Besides more than 2,800 international exhibitors, visitors can expect an extensive supporting program with four conferences and five forums. From the Cyber Security Forum and the electronica Automotive Conference to the CEO Roundtable: Experts and exhibitors will present and discuss the latest developments from around the world at electronica. With an eye on current trends, electronica 2016 will focus on it main themes, i.e. Automotive, Embedded Systems, Solid State Lighting, Wearables and Healthcare as well as the related topics of cyber security and the Internet of Things. All of these topics will also be reflected in the supporting program.  CEO Roundtable One of electronica's highlights is on the first day of the fair: the CEO Roundtable. The theme is “Connected Worlds—Safe and Secure,” and leading...
2016 - 09 - 24
China
Numerous major participants in the global semiconductor sector are engaging in deal-making to make themselves larger and more competitive. As a result, different industries within the sector will be controlled by fewer companies in the future.    In China, consolidation will also take place within the three broad sections of the semiconductor sector, namely foundry, IC testing/packaging and fabless design. According to the global market research firm TrendForce, various Chinese semiconductor enterprises will be integrated under the “virtual IDM” model during 2017. At the same time, the trend of integration will also become more noticeable among Chinese providers of semiconductor manufacturing equipment.  In the foundry industry, Chinese participants are lagging behind international competitors. Leading domestic foundry SMIC is currently using the 28nm process as its most advanced technology for mass production. While most international foundries have achie...
2016 - 09 - 24
Increasing Demand for Compact Electronics Driving Growth for 3D IC Market
The global 3D ICs market is considerably consolidated, with Taiwan Semiconductor Manufacturing Co. Ltd (TSMC) and Samsung Electronics Co. Ltd collectively accounting more than 50%, and a host of mid-sized and small companies holding the remaining market share as of 2012, according to a new report by Transparency Market Research (TMR). Product development through strategic collaborations is on the growth charts of top companies in the global 3D ICs market. A case in point is TSMC, which has collaborated with a host of electronic design automation vendors for the manufacture of 3D IC reference flows and 16 nm FinFet. For instance, TSMC collaborated with Cadence Design Systems Inc. to develop a particular 3D IC reference flow, which helps in inventive 3D stacking. Business expansion through R&D of 3D ICs is also what key companies in this market are focused on. Companies are planning to strengthen their R&D efforts for the development of new technologies. Product diversi...
2016 - 09 - 24
Technics /  
说明: PCB fast prototyping manufacturability designThe technical specifications required for the manufacturability of PCBs are related to the development status of the manufacturing process technology of PCB rapid proofing manufacturers and the manufacturers of printed boards. For example, for PCBs with a wire width of 0.1 mm and a minimum through hole diameter of 0.3 mm, some pcb fast proofing manufacturers cannot process them, and only some manufacturers with good equipment and process conditions can process them. Some designers do not pay attention to these problems. They think that PCB can be designed and manufactured quickly, or that the layout and wiring design of the printed board is correct. Whether it can be manufactured is the production and process. The concept is wrong. When considering the manufacturability specifications of PCBs, pcb rapid prototyping manufacturers should be determined according to the current processing level of printed boards and the process require...
说明: How do material choices increase performance?   You would be hard pressed to find an RF device that does notutilize printed circuit board substrate material in one form or another. This is but one ofthe many building block materials needed in a given design. All decisions are focused on materials that improve signa loss operating temperature stability over temperature heat sinking and solderability. Yet the material sals one edto decrease attenuation frequency shift, and limit thermal loss.Essential materials Selections That Should Be Reviewed:.Printed Circuit Board (PCB) Substrates.PCB Copper Weight .PCB Surface Finishes.Machined Metal Materials.Machined Metal Surface Finishes.Dielectric And Gasket Materials.Circuit Interface Conductors And Insulation Types
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