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2016 - 09 - 25
Application Industry: communicationApplication Product: Digital Fiber-Optic CommunicationLayers:8Finish : ENIGMaterial: FR4Outer Track W/S: 4/4milInner Track W/S: 3.5/3.5milBoard Thickness: 1.6mmMin. ...
2016 - 09 - 25
Application Industry: Industrial ControlApplication Products: Function BoardLayer: 16Surface Finish: ENIGMaterial: High TG FR4Outer Track W/S: 4/4milInner Track W/S: 3.5/3.5milBoard Thickness: 2.43mmM...
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Address: 407, Kanglan Fortune Center, Fuzhou Avenue, Fuyong Street, Baoan District, Shenzhen, Guangdong 518103, China
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Application Industry: Consumer ElectronicsApplication Products: Solid State DiskLayer: 10Special Processing: Impedance Control, Resin Plugging, Different Copper ThicknessAspect Ratio: 8:1Material: FR4Outer Track W/S: 4/4milInner Track W/S: 5/3.5milBoard Thickness: 2.0mmMin. Hole Diameter: 0.25mm
Application Industry: Consumer electronicsApplication Products: Solid State DiskLayer: 8Material: FR4Outer Track W/S: 4/4milInner Track W/S: 3.5/3.5milBoard Thickness: 1.6mmMin. Hole Diameter: 0.25mm
Applocation Industry: Consumer ElectronicsApplication Products: MID Tablet MotherboardLayer: 4Surface Finish: ENIGOuter Track W/S: 4/4milInner Track W/S: 4/4milBoard Thickness: 0.8mmMin. Diameter: 0.25mm
Application Industry: Consumer ElectronicsApplication Products: DDR PinboardLayer:8Special Surface Finish:ENIGMaterial: FR4Aspect Ratio: 8:1Surface Finish: ENIGOuter Track W/S: 4/4milInner Track W/S: 4/4milBoard Thickness: 2.4mmMin. Hole Diameter : 0.3mm
Application Industry: Consumer EletronicsApplication Products: Mobile MotherboardLayer: 8Special processing: HDISurface Finish: ENIGMaterial: HF FR4Outer Track W/S: 3/3milInner Track W/S: 3/3milBoard Thickness: 0.8mmMin. Hole Diameter: 0.1mm
Application Industry: Consumer ElectronicsApplication Products: USB3.0 PinboardLayer: 2Surface Finish: ENIGMaterial: FR4Outer Track W/S: 6/6milBoard Thickness: 1.6mmMin. Hole Diameter: 0.4mm
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