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2016 - 09 - 25
Application Industry: communicationApplication Product: Digital Fiber-Optic CommunicationLayers:8Finish : ENIGMaterial: FR4Outer Track W/S: 4/4milInner Track W/S: 3.5/3.5milBoard Thickness: 1.6mmMin. ...
2016 - 09 - 25
Application Industry: Industrial ControlApplication Products: Function BoardLayer: 16Surface Finish: ENIGMaterial: High TG FR4Outer Track W/S: 4/4milInner Track W/S: 3.5/3.5milBoard Thickness: 2.43mmM...
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Address: 407, Kanglan Fortune Center, Fuzhou Avenue, Fuyong Street, Baoan District, Shenzhen, Guangdong 518103, China
Technics  Technics
案例名称: Metal Core PCB's
说明: Metal Core PCB's  Conventional PCBs use FR4 epoxy glass-based material on both sides of a board. However, with the growing popularity of light-emitting diode or LED technology, metal core PCBs or MCPCBs are being deployed to deal with the increased heat LEDs generate. Fig. 1 below shows a metal core PCB.  Today, metal core PCBs are finding greater numbers of applications in the automobile industry, traffic light signal technology, in commercial buildings, shopping malls, and even inside homes.  MCPCBs use either an aluminum or copper core with the bottom side of the board serving as the heat sink.       MCPCBs are also used to dissipate heat in intense power-generating analog circuitry.  Metal core PCBs are connected through mounting holes and screws ...
说明: SPI A Must For Fine-Pitch Devices  Solder paste deposition 100% accuracy is especially important for PCBs that are highly populated with fine-pitch devices like QFNs, BGAs, and tiny passive component packages like 0201 and 00105. Those packages have very little pad area. Therefore, registration must be precise and accurate.   If you're dealing with a 01005 pad and if registration is off by a mil, this will shift placement and paste deposition by half the size of the pad. Without sufficient paste, a cold solder joint results. If too much paste is dispensed in micro BGA, CSP, or 0105 packages, it creates a short between the two edges of these packages. It's best to use paste type 4.0 or 4.5, which has small metal particles for better solder adhesion on the smaller BGA ...
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