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2016 - 09 - 25
Application Industry: communicationApplication Product: Digital Fiber-Optic CommunicationLayers:8Finish : ENIGMaterial: FR4Outer Track W/S: 4/4milInner Track W/S: 3.5/3.5milBoard Thickness: 1.6mmMin. ...
2016 - 09 - 25
Application Industry: Industrial ControlApplication Products: Function BoardLayer: 16Surface Finish: ENIGMaterial: High TG FR4Outer Track W/S: 4/4milInner Track W/S: 3.5/3.5milBoard Thickness: 2.43mmM...
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Address: Building 1, Huaide Cuigang Industrial Zone 3, Fuyong Street, Baoan District , Shenzhen, Guangdong 518103, China
Service FAQ's
The development of PCB and FPC led birth of rigid flex boards. Rigid flex printed circuit boards are PCBs using a combination of flexible and rigid board technologies. Rigid flex boards are PCBs with combination of FPC and PCB. First, electronic engi...
Today's high density interconnect (HDI) printed circuit boards (PCBs) increase the functionality of a circuit board while utilizing less area, driven by the miniaturization of components and IC substrate packages. This enables the use of an increasin...
As we introduced before what is Ball Grid Array. A ball grid array (BGA) is a type of surface-mount packaging (a chip carrier) used for integrated circuits. BGA packages are used to permanently mount devices such as microprocessors. There are ma...
What's OSP ?OSP (Organic Solderability Preservative) is the most popular final surface finishing for PWBs.OSP film has excellent humidity resistance to protect copper oxidation. For example, F2 series protect copper surface up to twelve month. C...
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