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Types of Ball Grid Array
Date: 2016-11-12
Views: 166

As we introduced before what is Ball Grid Array. A ball grid array (BGA) is a type of surface-mount packaging (a chip carrier) used for integrated circuits. BGA packages are used to permanently mount devices such as microprocessors.
 
There are mainly three types of BGAs: PBGA (plastic ball grid array), CBGA (ceramic ball grid array), and TBGA (tape ball grid array). A specific form of the BGA can have a certain size, but should use the same physical structure and the same material. The following will focus on the analysis of three specific BGA package, each kind of structure form is different.

PBGA

Currently the most common production of BGA package form is plastic ball grid array package PBGA. It has the advantages of: - glass fiber and BT resin substrates and 0.4mm thick - chip is directly welded on the substrate, chip and the base piece by a wire connection, molded plastic can chip packaging, wire connection with most of the surface of the substrate. Normally, BT resin/glass laminate is used as the substrate, plastic as the packaging material. Solder balls can be classified into lead and lead-free solder. No other solder is needed to connect the solder balls with packaging body.

CBGA

CBGA has the longest history among the three types of BGAs. The material of substrate is multi-layer ceramic. Metal cover is soldered onto the substrate by packaging solder in order to protect the chip, leads and pad. High temperature eutectic solder is used as the material of solder balls.

TBGA

TBGA is a structure with a cavity. There are two kinds of interconnections between chip and substrate: inverted solder bonding and lead bonding.

The three kinds of BGA has its different advantages. The features (advantages and disadvantages) comparison between the above three types of BGAs is shown in the below table:

Types of Ball Grid Array

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