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14th Electronic Circuits World Convention to be Held in Korea

Date: 2016-09-24
views: 53

The 14th Electronic Circuits World Convention will be held in KINTEX, Goyang City, S. Korea from April 25 to April 27, 2017 along with KPCAshow hosted by Korea Printed Circuits Association (KPCA) as well as World Electronic Circuits Council (WECC).

 

 

This premier international conference is a triennial event for a world-class gathering of professionals from academia, industry and government, providing a forum to exchange ideas and recent developments in various fields of electronic interconnection and fostering networking and collaborations.

 

 

Topics

 

 

The ECWC14 invites submission of abstracts on a wide range of topics, spanning both business and technical topics. The topics of interest include, but not limited to:

 

 

Management

 


M1 Market Trends and Outlook
Global or Regional Market of PCB, Materials, Packaging, Assembly and End Products

 

 

M2 Supply Chain Management (SCM) Inventory Management, Contact Electronic Manufacturing Services, Outsourcing, Supply Chain Collaboration and Supply Chain Risk Management

 

 

M3 Standard, Certification and Qualifications IEC/ISO, UL, Third Party Quality assessment, IP, Standard and Product Certification

 

 

M4 Environment, Health and Safety (EHS) Environmental Registration, Halogen-free, Lead-free, Incorporating green technology

 

 

M5 Business Strategy Business Model, Business Strategy and Marketing Strategy

 

 

Technology

 


T1 Materials and Components New material on board manufacturing and packaging, New components for SMT and assembly

 

 

T2 Design and Data Transfer Electronic Circuit Design, Design Automation, Signal Integrity and EMC, Electrical and Thermal Simulation, Modelling, Data Transfer and Exchange

 

 

T3 Test and Reliability Inspection, Structure Integrity, Bare Board Testing, Reliability Test and Failure Analysis

 

 

T4 PCB Processes, Chemical and Physical Multi-layer Circuit Formation Processes

 

 

T5 HDI / Fine Circuit Fabrication, Processes and Equipment Processes and Equipment for Fine Circuit Fabrication, HDI Manufacturing Processes and Equipment

 

 

T6 Flexible Circuit Manufacturing Technology of Flexible Circuits, Multilayer Flex and Rigid Flex, New Flexible Circuits and Applications

 

 

T7 Application Specific Circuits Wearable, IoT, Automobile, High Power, High Speed, LED and Energy

 

 

T8 Packaging/Substrate Technology Substrate and Packaging Technology

 

 

T9 SMT and Assembly Conformal Coating, Fluxes and Cleaning, Pb free soldering and Micro-soldering.

 

 

T10 Emerging Technologies Printed electronics, Device Embedded Substrate, FOWLP, 3D circuit

 

 

There're two ways to submit the abstract.

One, which is preferred, is to submit through ECWC section on KPCA's English website.

 

 

The other is to e-mail the filled paper application form to your local association as well as ECWC secretariat.

 

 

 

 

 

 

 

 

 

 

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