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2016 - 09 - 25
Application Industry: communicationApplication Product: Digital Fiber-Optic CommunicationLayers:8Finish : ENIGMaterial: FR4Outer Track W/S: 4/4milInner Track W/S: 3.5/3.5milBoard Thickness: 1.6mmMin. ...
2016 - 09 - 25
Application Industry: Industrial ControlApplication Products: Function BoardLayer: 16Surface Finish: ENIGMaterial: High TG FR4Outer Track W/S: 4/4milInner Track W/S: 3.5/3.5milBoard Thickness: 2.43mmM...
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Products 产品详情
产品名称: 10 Layer Impedance Control Resin Plugging PCB
上市日期:2016-09-25
  • 10 Layer Impedance Control Resin Plugging PCB 10 Layer Impedance Control Resin Plugging PCB
  • Description
  • Parameters
  • Application Industry

Application Industry: Consumer Electronics

Application Products: Solid State Disk

Layer: 10

Special Processing: Impedance Control, Resin Plugging, Different Copper Thickness

Aspect Ratio: 8:1

Material: FR4

Outer Track W/S: 4/4mil

Inner Track W/S: 5/3.5mil

Board Thickness: 2.0mm

Min. Hole Diameter: 0.25mm

10 Layer Impedance Control Resin Plugging PCB

10 Layer Impedance Control Resin Plugging PCB

10 Layer Impedance Control Resin Plugging PCB

10 Layer Impedance Control Resin Plugging PCB

Application Industry: Consumer Electronics

Application Products: Solid State Disk

Layer: 10

Special Processing: Impedance Control, Resin Plugging, Different Copper Thickness

Aspect Ratio: 8:1

Material: FR4

Outer Track W/S: 4/4mil

Inner Track W/S: 5/3.5mil

Board Thickness: 2.0mm

Min. Hole Diameter: 0.25mm

Consumer Electronics

Application Products: Solid State Disk

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  • 发布时间: 2016 - 09 - 25
    Application Industry: Consumer ElectronicsApplication Products: Solid State DiskLayer: 10Special Processing: Impedance Control, Resin Plugging, Different Copper ThicknessAspect Ratio: 8:1Material: FR4Outer Track W/S: 4/4milInner Track W/S: 5/3.5milBoard Thickness: 2.0mmMin. Hole Diameter: 0.25mm
  • 发布时间: 2016 - 09 - 25
    Application Industry: Consumer electronicsApplication Products: Solid State DiskLayer: 8Material: FR4Outer Track W/S: 4/4milInner Track W/S: 3.5/3.5milBoard Thickness: 1.6mmMin. Hole Diameter: 0.25mm
  • 发布时间: 2016 - 09 - 25
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