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2016 - 09 - 25
Application Industry: communicationApplication Product: Digital Fiber-Optic CommunicationLayers:8Finish : ENIGMaterial: FR4Outer Track W/S: 4/4milInner Track W/S: 3.5/3.5milBoard Thickness: 1.6mmMin. ...
2016 - 09 - 25
Application Industry: Industrial ControlApplication Products: Function BoardLayer: 16Surface Finish: ENIGMaterial: High TG FR4Outer Track W/S: 4/4milInner Track W/S: 3.5/3.5milBoard Thickness: 2.43mmM...
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Products 产品详情
产品名称: 10 Layer Medium TG Gold Finger PCB
上市日期:2016-09-25
  • 10 Layer Medium TG Gold Finger PCB 10 Layer Medium TG Gold Finger PCB
  • Description
  • Parameters
  • Application Industry

Application Industry: Industrial Control

Layer:10
Special Processing: Gold Finger

Surface Finish: ENIG

Material: Medium TG FR4
Outer Track W/S : 4/4mil
Board Thickness : 1.6mm
Min. Hole Diameter: 0.2mm

10 Layer Medium TG Gold Finger PCB

10 Layer Medium TG Gold Finger PCB

10 Layer Medium TG Gold Finger PCB

10 Layer Medium TG Gold Finger PCB

Layer:10
Special Processing: Gold Finger

Surface Finish: ENIG

Material: Medium TG FR4
Outer Track W/S : 4/4mil
Board Thickness : 1.6mm
Min. Hole Diameter: 0.2mm

 

Industrial Control



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  • 发布时间: 2016 - 09 - 25
    Application Industry: Industrial ControlLayer:10Special Processing: Gold FingerSurface Finish: ENIGMaterial: Medium TG FR4Outer Track W/S : 4/4milBoard Thickness : 1.6mmMin. Hole Diameter: 0.2mm
  • 发布时间: 2016 - 09 - 25
    Application Industry: CommunicationApplication Product: Fiber-Optic Interface BoardLayer: 6Special Processing: Gold FingerSurface Finish: Immersion GoldMaterial:High TG FR4Outer Layer Track W/S: 5/5milInner Layer Track W/S: 5/5milBoard Thickness: 1.0mmMin. Hole Diameter: 0.2mm
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