Products Products
Hot Products / Hot Sales
2016 - 09 - 25
Application Industry: communicationApplication Product: Digital Fiber-Optic CommunicationLayers:8Finish : ENIGMaterial: FR4Outer Track W/S: 4/4milInner Track W/S: 3.5/3.5milBoard Thickness: 1.6mmMin. ...
2016 - 09 - 25
Application Industry: Industrial ControlApplication Products: Function BoardLayer: 16Surface Finish: ENIGMaterial: High TG FR4Outer Track W/S: 4/4milInner Track W/S: 3.5/3.5milBoard Thickness: 2.43mmM...
Contact Us
联系我们
Tel: click here, contact us
Fax: click here, contact us
E-Mail: click here, contact us
Mobile: click here, contact us
Skype: click here, contact us
Address: Building 1, Huaide Cuigang Industrial Zone 3, Fuyong Street, Baoan District , Shenzhen, Guangdong 518103, China
Products 产品中心
Application Industry: Industrial ControlApplication Products: Function BoardLayer: 16Surface Finish: ENIGMaterial: High TG FR4Outer Track W/S: 4/4milInner Track W/S: 3.5/3.5milBoard Thickness: 2.43mmMin. Hole Diameter: 0.75mm
Application Industry: Industrial ControlApplication Products: Hand-held Automobile diagnosis equipmentLayer: 10Surface Finish: ENIGMaterial: FR4Outer Ttack W/S: 4.5/2.5milInner Track W/S: 4/3.5milBoard Thickness: 1.0mmMin. Hole Diameter: 0.3mm
Application Industry: Industrial ControlApplication Products: Gold Finger PalletLayer: 10Special Processing: Gold FingerMaterial: Medium TG FR4Outer Track W/S: 4/4milInner Track W/S: 4/4milBoard Thickness: 1.6mmMin. Hole Diameter: 0.2mm
Application Industry: Industrial ControlApplication Products: Device MainboardLayer: 14Special processing: Blind & Buried ViasSurface Finish: ENIGMaterial: FR4Outer Track W/S: 4/5milInner Track W/S: 4/3.5milBoard Thickness: 1.6mmMin. Hole Diameter: 0.2mm
Application Industry: Industrial ControlApplication Products: Planer TransformerLayer: 2Special Processing: Coil Resistance, Heavy CopperSurface Finish: HASLMaterial: TG170, FR4Board Thickness: 1mmMin. Hole Diameter: 0.5mm
Application Industry: Industrial ControlApplication Products: Unmanned Aerial Vehicle MotherboardLayer: 14Special Processing: 0.5CSPSurface Finish: ENIGMaterial: High TG FR4Outer Track W/S: 3.5/3.5milInner Track W/S: 3/3milBoard Thickness: 1.6mmMin. Hole Diameter: 0.15mm
9页次1/2HomePre12NextEnd
回到顶部
深圳市汇和精密电路有限公司
Scan the QR code
to follow us 
Contact us
Copyright ©2019 Shenzhen Huihe Circuits Co.,Ltd.
犀牛云提供云计算服务
ADD : Building 1, Huaide Cuigang Industrial Zone 3, Fuyong Street, Baoan District , Shenzhen, Guangdong 518103, China

Fax:+86 0755-2788 8009
Post Code:330520
X
等待加载动态数据...

等待加载动态数据...

等待加载动态数据...

等待加载动态数据...

等待加载动态数据...

等待加载动态数据...

等待加载动态数据...

等待加载动态数据...

等待加载动态数据...

等待加载动态数据...

等待加载动态数据...

等待加载动态数据...

等待加载动态数据...

等待加载动态数据...

展开
回到顶部